| Customization: | Available |
|---|---|
| Warranty: | 1 Year |
| Magnification: | >1000X |
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Field Emission Scanning Electron Microscope (FE-SEM) with Focused Ion Beam (FIB) Columns
The CIQTEK DB550 Focused Ion Beam Scanning Electron Microscope (FIB-SEM) has a focused ion beam column for nano-analysis and specimen preparation. It utilizes "super tunnel" electron optics technology, low aberration and non-magnetic objective design, and has the "low voltage, high resolution" feature to ensure its nanoscale analytical capabilities.
The ion columns facilitate a Ga+ liquid metal ion source with highly stable and high quality ion beams to ensure nanofabrication capabilities. The DB550 is an all-in-one nano-analysis and fabrication workstation with an integrated nano-manipulator, gas injection system, and user-friendly GUI software.
| CIQTEK FIB-SEM DB550 Specifications | ||
| Electron Optics | Electron Gun Type | High Brightness Schottky Field Emission Electron Gun |
| Resolution | 0.9 nm@15 kV; 1.6 nm@1 kV | |
| Acceleration Voltage | 0.02 kV to 30 kV | |
| Ion Beam System | Ion Source Type | Gallium |
| Resolution | 3 nm@30 kV | |
| Acceleration Voltage | 0.5 kV to 30 kV | |
| Specimen Chamber | Vacuum System | Fully Automatic Control, Oil-free Vacuum System |
| Cameras | Three Cameras | |
| (Optical navigation x1 + chamber monitor x2) | ||
| Stage Type | Motorized 5-axis Mechanical Eucentric Specimen Stage | |
| Stage Range | X=110 mm, Y=110 mm, Z=65 mm | |
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X=110 mm, Y=110 mm, Z=65 mm T: -10°~+70°, R:360° |
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| SEM Detectors and Extensions | Standard | In-lens Electron Detector |
| Everhart-Thornley Detector (ETD) | ||
| Optional | Retractable Back-Scattered Electron Detector (BSED) | |
| Retractable Scanning Transmission Electron Microscopy Detector (STEM) | ||
| Energy Dispersive Spectrometer (EDS/EDX) | ||
| Electron Backscatter Diffraction Pattern (EBSD) | ||
| Nano-manipulator | ||
| Gas Injection System | ||
| Plasma Cleaner | ||
| Specimen Exchange Loadlock | ||
| Trackball & Knob Control Panel | ||
| User Interface | Languages | English |
| Operating System | Windows | |
| Navigation | Optical Navigation, Gesture Quick Navigation | |
| Automatic Functions | Auto Brightness & Contrast, Auto Focus, Auto Stigmator | |
>> Semiconductor
In the semiconductor industry, IC chips may encounter various failures. Various methods are used to analyze the chips to improve reliability. In particular, focused ion beam (FIB) analysis is a reliable analytical technique.
Specimen Characterization / Micro-Nano Fabrication / Cross-section Analysis / TEM Specimen Preparation / Failure Analysis
>> New Energy Industry
Observation and analysis of material cross-sections for research and process development.
Morphology Observation / Particle Size Analysis / Cross-section Analysis / Composition and Phase Analysis / Failure Analysis of Lithium-ion Battery Material / TEM Sample Preparation
>> Ceramic Material
Material analysis: The FIB-SEM system can perform high-precision micro-nano machining and imaging of ceramic materials, combined with various signal detection modes such as backscattered electrons (BSE), energy-dispersive X-ray spectroscopy (EDX), Electron Backscattered Diffraction Pattern (EBSD), and secondary ion mass spectrometry (SIMS), to study the material in micro to nano-scale with three-dimensional space in depth.
>> Alloy Material
To increase the strength, hardness, toughness, etc., of metals, other substances such as ceramics, metals, fibers, etc., are added into the metal using methods such as metallurgy, casting, extrusion, etc., which are called reinforced phases.
TEM specimen prepared by an FIB-SEM is used to observe information such as reinforced phases and boundary atoms through transmitted electron signals. TEM specimens can be used for transmission Kikuchi Diffraction (TKD) analysis, metallographic analysis, compositional analysis, and in-situ testing of alloy cross-section.
Highly integrated user interface platform
SEM microscope imaging and processing functions are integrated within an overall user interface, with comparative references displayed on the left and right.
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